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MAX9814 microphone amplifier: specs and pinout

Electret microphone amplifier with automatic gain control. The maker data sheet covers the MAX9814 chip, whose output is centred on a DC bias; the breakout board is not covered, so its output level is not documented.

Every value cites its sourceChip-level pinout

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Specs

SpecValueSource
Supply voltage (VDD)2.7 V to 5.5 Vsource
p.2 Electrical Characteristics, Operating Voltage
Supply current3.1 mA typ, 6 mA max (VDD = 3.3 V)source
p.2 Electrical Characteristics
Gain settings (GAIN pin)40 dB (GAIN = VDD), 50 dB (GAIN = GND), 60 dB (GAIN unconnected); AGC reduces gain by up to 20 dBsource
p.2 Maximum/Minimum Gain; p.6 pin 10
AGC attack/release ratio1:500 (A/R = GND), 1:2000 (A/R = VDD), 1:4000 (A/R unconnected); hold time 30 ms fixedsource
p.2; p.6 pin 9; p.1 General Description
Output bias at MICOUT, bare chip (no signal)1.23 V typ (1.14 V to 1.32 V)source
p.3 Electrical Characteristics, MICOUT Bias
Microphone bias output2.0 V typ (1.84 V to 2.18 V)source
p.3 Microphone Bias
Maximum output level0.707 Vrms at 1 % THD+N (VTH = MICBIAS)source
p.2
Signal-to-noise ratio64 dB A-weightedsource
p.2
Total harmonic distortion plus noise0.04 % typ (test conditions on p.2)source
p.2
Operating temperature-40 C to +85 Csource
p.2 Absolute Maximum Ratings

Power

ValueSource
Supply2.7 V to 5.5 Vsource
p.2 Electrical Characteristics
Current3.1 mA typ, 6 mA max at VDD = 3.3 Vsource
p.2 Electrical Characteristics

Chip pins

These are the pins of the chip on the module, from the chip datasheet. The module's own header may label or expose them differently.

Pin rows are the bare MAX9814 TDFN package from the maker data sheet. The breakout board (header order, which gain/AGC straps are fitted, onboard capacitors and microphone) is not covered by an official document; read the labels on your board.

PinFunctionVoltageNotesSource
1CT: Timing capacitor connection; sets AGC attack and release timesChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
2SHDN: Active-low shutdown controlChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
3CG: Amplifier DC offset adjust; 2.2 uF capacitor to GNDChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
4, 11N.C.: No connection; connect to GNDChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
5VDD: Power supply; bypass to GND with 1 uFChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
6MICOUT: Amplifier outputChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
7GND: GroundChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
8MICIN: Microphone noninverting inputChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
9A/R: Tri-level attack/release ratio select: GND 1:500, VDD 1:2000, unconnected 1:4000Chip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
10GAIN: Tri-level gain: VDD 40 dB, GND 50 dB, unconnected 60 dB (uncompressed)Chip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
12BIAS: Amplifier bias; bypass to GND with 0.47 uFChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
13MICBIAS: Microphone bias outputChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
14TH: AGC threshold control; tie to MICBIAS to disable AGCChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description
EPEP: Exposed pad; connect to GNDChip pin (14-pin TDFN), not the module header.source
p.6 Pin Description

Build with it

Project ideas for the MAX9814 microphone amplifier. Each link opens Soldr with the prompt filled in; Soldr assigns the pins, checks power and shows how to wire every part.

Common mistakes

Not covered by the official source

Sources